Cixi Hengpu
The company is a key equipment supplier in the field of Metal Injection Molding (MIM) and Wide Band Gap Semiconductor, based on material research and centered on high-temperature thermal field environment control technology. It mainly engages in the research and development, production, and sales of thermal equipment such as Metal Injection Molding (MIM) degreasing sintering furnaces, silicon carbide crystal growth furnaces, and silicon carbide homogeneous epitaxial equipment.
The company has accumulated ten years of temperature and pressure control technology in material research and equipment design. Through temperature closed-loop control, high-precision pressure control, axial and radial separation technology, and dual control technology, it provides larger, faster, and thicker solutions for the SiC long crystal industry, contributing to the breakthrough of domestic epitaxial equipment to international standards.
浙ICP備130087458959-1號(hào)
